POSTECH develops ultra-thin semiconductor chip stacking technology...4 times more integrated than HBM
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From the left, Professor Seok Kim of the Department of Mechanical Engineering at Pohang University of Science and Technology, Woohyun Kim, an integrated program researcher at Pohang University of Science and Technology, and Dr.
From the left, Professor Seok Kim of the Department of Mechanical Engineering at Pohang University of Science and Technology, Woohyun Kim, an integrated program researcher at Pohang University of Science and Technology, and Dr. Hohyun Geum of the Korea Institute of Industrial Technology. Provided by Pohang University of Science and Technology A domestic research team has developed a technology to stably stack ultra-thin semiconductor chips, which are about one-fifth the thickness of a human hair, over 10 layers. It is a technology that realizes an integration density approximately four times higher than that of high-bandwidth memory (HBM), which is attracting worldwide attention. Pohang University of Science and Technology (POSTECH) is led by Kim Seok...
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